Jobs in Japan
Explore hand-picked jobs in Japan for English speakers across tech, education, marketing, and more.
Vetted companies only. Apply from overseas.
Explore hand-picked jobs in Japan for English speakers across tech, education, marketing, and more.
Vetted companies only. Apply from overseas.
At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future. Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career. The role involves leading technology development and supply chain bring up of advanced substrate technologies to support AMD product roadmap. The candidate should have a proven track record in developing advanced packaging technologies at a substrate supplier, OSAT or Fabless/IDM, as well as identifying and enabling new substrate. He/she should have a hands-on approach to new process development with a deep knowledge of packaging and board design rules, process flows and materials. They should have excellent oral and written communication skills to communicate ideas and technology target requirements with suppliers, internal partners, product architects and AMD management. Key responsibilities include defining advanced substrate and board technology roadmap across pitch scaling, power delivery, signal integrity and cost vectors, partnering with AMD architects, designers, and product owners to define high yielding, cost effective substrate solutions which meet product requirements, selecting development partners to bring into AMD supply chain to enable industry leading substrate and PCB technology building blocks, partnering with product, quality and manufacturing engineering teams to meet various milestones for manufacturability, yield and reliability from concept through NPI, and qualifying package substrates of new products meeting cost and yield targets.
- A good depth of relevant experience leading cross functional teams to achieve technology certification, yield/cost reduction initiatives - Proven record of communicating complex technical challenges to executive level/management - Prior experience working with international teams across various time zones.
- AMD benefits at a glance
